\ Location: Melaka Job ID: HRC0649785 Job description In your new role you will: Responsible for IPTESTERS maintenance systematic and activities in…
\ Job Description In your new role you will: Responsible for IPTESTERS maintenance systematic and activities in order to achieve best equipment…
Come join Analog Devices (ADI) a place where Innovation meets Impact. For more than 55 years, Analog Devices has been inventing new…
Responsible for organization\'s manufacturing assembly processes (wire bond), define product assembly procedures and FMEA. Initiate, direct, and coordinate through the efforts of…
Company DescriptionAt Western Digital, we are on a mission to unlock the potential of data so people, companies and organizations everywhere can…
Company DescriptionAt Western Digital, we are on a mission to unlock the potential of data so people, companies and organizations everywhere can…
Our client is a Multinational Semiconductor company in Penang. They are seeking a Sr FOL Process Engineer with exposure to Wire Bond…
Company DescriptionAt Western Digital, we are on a mission to unlock the potential of data so people, companies and organizations everywhere can…
\ Location: Melaka Job ID: HRC0674345 Job description In your new role you will: Manage maintenance cost in sustaining the equipment to…
\ Job Description In your new role you will: Manage maintenance cost in sustaining the equipment to it fullest performance. Gather previous…
Company DescriptionAt Western Digital, our vision is to power global innovation and push the boundaries of technology to make what you thought…
Company DescriptionAt Western Digital, our vision is to power global innovation and push the boundaries of technology to make what you thought…
\ \ Job Description In your new role you will: Wire Bond expert, responsible to achieve robust and auto pilot processes Sustains…
\ \ MalaysiaJob details Posted 18 August 2024 SalaryNegotiable LocationSelangor Job type Discipline Reference268765_1723969287Wire Bond Development EngineerJob descriptionThis rapidly expanding semiconductor company…
\ \ Location: Melaka Job ID: HRC0752317Job description In your new role you will: Wire Bond expert, responsible to achieve robust and…
\ \ MalaysiaJob details Posted 18 August 2024 SalaryNegotiable LocationMalaysia Job type Discipline Reference252045_1723969380Wire Bond EngineerJob descriptionOur client is a multinational semiconductor…
\ \ MalaysiaJob details Posted 17 September 2024 SalaryRM10000 RM15000 per month LocationMalaysia Job type Discipline Reference252045_1726550199Wire Bond Principal Process EngineerJob descriptionOur…
\ \ MalaysiaJob details Posted 09 June 2024 SalaryNegotiable LocationMalaysia Job type Discipline Reference273052_1717945453Sr Process Engineering Manager (Wire Bond)Job descriptionOur client is…
MalaysiaJob details Posted 05 December 2024 SalaryRM7000 RM9500 per month LocationMalaysia Job type Discipline Reference278126_1733342773Sr Process Engineer (Wire Bond, Die Bond)Job descriptionOur…
Analog Devices, Inc. (NASDAQ: ) is a global semiconductor leader that bridges the physical and digital worlds to enable breakthroughs at the…