\ Location: Melaka, Melaka Job ID: HRC0421210 Job description In your new role you will: Establish and/or modify planned maintenance guide to…
\ Location: Melaka Job ID: HRC0674345 Job description In your new role you will: Manage maintenance cost in sustaining the equipment to…
\ Job Description In your new role you will: Manage maintenance cost in sustaining the equipment to it fullest performance. Gather previous…
\ \ MalaysiaJob details Posted 18 August 2024 SalaryNegotiable LocationSelangor Job type Discipline Reference268765_1723969287Wire Bond Development EngineerJob descriptionThis rapidly expanding semiconductor company…
\ \ MalaysiaJob details Posted 09 June 2024 SalaryNegotiable LocationMalaysia Job type Discipline Reference273052_1717945453Sr Process Engineering Manager (Wire Bond)Job descriptionOur client is…
\ \ MalaysiaJob details Posted 09 June 2024 SalaryNegotiable LocationMalaysia Job type Discipline Reference273443_1717945401Wire Bond Process Development ManagerJob descriptionOur client is a…
\ \ MalaysiaJob details Posted 17 September 2024 SalaryNegotiable LocationSelangor Job type Discipline Reference268765_1726550364Wire Bond Development EngineerJob descriptionThis rapidly expanding semiconductor company…
About the job Assembly Staff EngineerCompany BackgroundWe are representing world known company with a global footprint that provides high performance, semiconductor based…
\ Job Description In your new role you will: To sustain, improve the process in order to deliver products to customers at…
\ Location: Melaka, Melaka Job ID: HRC0519776 Job description In your new role you will: To sustain, improve the process in order…
MalaysiaJob details Posted 22 November 2024 SalaryNegotiable LocationSelangor Job type Discipline Reference268765_1732267987Wire Bond Development EngineerJob descriptionThis rapidly expanding semiconductor company in Selangor…
\ Location: Melaka Job ID: HRC0372399 Job description In your new role you will: Develop and realize process & maintenance concepts. Support…
\ \ MalaysiaJob details Posted 19 May 2024 SalaryNegotiable LocationMalaysia Job type Discipline Reference273443_1716051585Wire Bond Process Development ManagerJob descriptionOur client is a…
\ \ MalaysiaJob details Posted 19 July 2024 SalaryRM15000 RM21000 per month LocationMalaysia Job type Discipline Reference273052_1721349840Sr Process Engineering Manager (Wire Bond)Job…
\ \ MalaysiaJob details Posted 19 July 2024 SalaryNegotiable LocationMalaysia Job type Discipline Reference273443_1721349295Wire Bond Process Development ManagerJob descriptionOur client is a…
\ Company BackgroundWe are representing world known company with a global footprint that provides high performance, semiconductor based power electronic solutions. As…
\ \ Job Description This rapidly expanding semiconductor company in Selangor is seeking a Wire Bond Development Engineer. Key Responsibilities Research and…
\ \ Location: Melaka Job ID: HRC0775119Job description In your new role you will: To sustain, improve the process in order to…
\ \ MalaysiaJob details Posted 23 October 2024 SalaryNegotiable LocationMalaysia Job type Discipline Reference271238_1729681599Wire Bond Process EngineerJob descriptionThis rapidly expanding global semiconductor…
\ Job Description In your new role you will: Establish and/or modify planned maintenance guide to ensure all equipment have reliable machine…