\ \ Job Description This rapidly expanding semiconductor company in Selangor is seeking a Wire Bond Development Engineer. Key Responsibilities Research and…
\ \ MalaysiaJob details Posted 09 June 2024 SalaryNegotiable LocationMalaysia Job type Discipline Reference273443_1717945401Wire Bond Process Development ManagerJob descriptionOur client is a…
\ \ Job Description This rapidly expanding semiconductor company in Selangor is seeking a Die Bond Development Engineer who specializes in Soft…
\ Company Description At Western Digital, our vision is to power global innovation and push the boundaries of technology to make what…
\ Location: Melaka Job ID: HRC0338347 Job description In your new role you will: Sustains and continuously improves qualified technologies in volume…
\ \ Location: Melaka Job ID: HRC0775119Job description In your new role you will: To sustain, improve the process in order to…
\ \ Job Description In your new role you will: To sustain, improve the process in order to deliver products to customers…
\ \ MalaysiaJob details Posted 19 May 2024 SalaryNegotiable LocationMalaysia Job type Discipline Reference273443_1716051585Wire Bond Process Development ManagerJob descriptionOur client is a…
\ Job Description In your new role you will: Develop and realize process & maintenance concepts. Support new product & equipment for…
\ \ Job Description In your new role you will: Wire Bond expert, responsible to achieve robust and auto pilot processes Sustains…
\ Job Description In your new role you will: Sustains and continuously improves qualified technologies in volume production with regards to stability,…
\ \ Location: Melaka Job ID: HRC0752317Job description In your new role you will: Wire Bond expert, responsible to achieve robust and…
\ \ Location: Melaka Job ID: HRC0169097 Job description In your new role you will: Sustains and continuously improves qualified technologies in…
\ Job Description In your new role you will: To drive wire bond planned maintenance systematic & methodology to ensure machine performance…
\ Job Description In your new role you will: To drive wire bond planned maintenance systematic & methodology to ensure machine performance…
\ Location: Melaka Job ID: HRC0472631 Job description In your new role you will: To drive wire bond planned maintenance systematic &…
\ Malaysia Job details Posted 04 November 2023 SalaryRM5000 RM8000 per annum LocationMalaysia Job type Discipline Reference268089_1699091116 Die Bond Process Engineer Job…
\ Location: Melaka Job ID: HRC0372399 Job description In your new role you will: Develop and realize process & maintenance concepts. Support…
\ \ Location: Melaka Job ID: HRC0169097 Job description In your new role you will: Sustains and continuously improves qualified technologies in…
\ \ Job details\ \ \ \ Posted 04 November 2023\ \ \ SalaryNegotiable\ \ \ LocationSelangor\ \ \ Job type Permanent…