\ KEY OBJECTIVES Manage and execute Mechanical Construction works for a Central Processing Platform (CPP) starting from EPCIC tendering until completion of…
\ Company Description The future. It\\\'s on you. You & Western Digital. We\\\'ve been storing the world\\\'s data for more than 50…
\ StatusPOSITION : Senior Engineer, Instrumentation (Telecommunications) (Offshore)REPORTING TO : Head of Lang Lebah Offshore Engineering Section DIVISION/DEPARTMENT : LLD LLF/E Lang…
\ \ MalaysiaJob details Posted 18 August 2024 SalaryNegotiable LocationSelangor Job type Discipline Reference268765_1723969287Wire Bond Development EngineerJob descriptionThis rapidly expanding semiconductor company…
\ \ Kulim, MY Mar 28, 2024 16345 Be part of our team! AT&S, a world leading high tech PCB & IC…
\ \ MalaysiaJob details Posted 09 June 2024 SalaryNegotiable LocationMalaysia Job type Discipline Reference273052_1717945453Sr Process Engineering Manager (Wire Bond)Job descriptionOur client is…
\ \ MalaysiaJob details Posted 23 October 2024 SalaryNegotiable LocationMalaysia Job type Discipline Reference271238_1729681599Wire Bond Process EngineerJob descriptionThis rapidly expanding global semiconductor…
\ \ MalaysiaJob details Posted 17 September 2024 SalaryNegotiable LocationSelangor Job type Discipline Reference268765_1726550364Wire Bond Development EngineerJob descriptionThis rapidly expanding semiconductor company…
\ \ MalaysiaJob details Posted 21 July 2024 SalaryNegotiable LocationMalaysia Job type Discipline Reference268136_1721495419Die Bond Equipment EngineerJob descriptionThis rapidly expanding semiconductor company…
\ Malaysia Job details Posted 04 November 2023 SalaryNegotiable LocationMalaysia Job type Discipline Reference268136_1699091036 Die Bond Equipment Engineer Job description This rapidly…
\ Location: Melaka Job ID: HRC0372399 Job description In your new role you will: Develop and realize process & maintenance concepts. Support…
\ Malaysia Job details Posted 12 September 2023 SalaryNegotiable LocationMalaysia Job type Discipline Reference268136_1694500453 Die Bond Equipment Engineer Job description This rapidly…
\ Available Positions: Equipment Engineer/ Senior Engineer Process Engineer/ Senior Engineer Job Responsibilities: 1.Equipment Engineer/ Senior Engineer: Lead in project management and…
\ \ MalaysiaJob details Posted 19 July 2024 SalaryRM15000 RM21000 per month LocationMalaysia Job type Discipline Reference273052_1721349840Sr Process Engineering Manager (Wire Bond)Job…
\ \ MalaysiaJob details Posted 13 May 2024 SalaryNegotiable LocationMalaysia Job type Discipline Reference268136_1715569407Die Bond Equipment EngineerJob descriptionThis rapidly expanding semiconductor company…
\ Malaysia Job details Posted 18 January 2024 SalaryNegotiable LocationMalaysia Job type Discipline Reference268136_1705541484 Die Bond Equipment Engineer Job description This rapidly…
\ \ Job Description This rapidly expanding semiconductor company in Selangor is seeking a Wire Bond Development Engineer. Key Responsibilities Research and…
\ \ Location: Melaka Job ID: HRC0775119Job description In your new role you will: To sustain, improve the process in order to…
\ \ Job Description In your new role you will: To sustain, improve the process in order to deliver products to customers…
\ Malaysia Job details Posted 19 February 2024 SalaryNegotiable LocationMalaysia Job type Discipline Reference268136_1708338802 Die Bond Equipment Engineer Job description This rapidly…