Flex is the diversified manufacturing partner of choice that helps market leading brands design, build and deliver innovative products that improve the…
Responsible for organization\'s manufacturing assembly processes (wire bond), define product assembly procedures and FMEA. Initiate, direct, and coordinate through the efforts of…
Flex is the diversified manufacturing partner of choice that helps market leading brands design, build and deliver innovative products that improve the…
Company DescriptionAt Western Digital, our vision is to power global innovation and push the boundaries of technology to make what you thought…
\ Malaysia Job details Posted 04 November 2023 SalaryRM5000 RM8000 per annum LocationMalaysia Job type Discipline Reference268089_1699091116 Die Bond Process Engineer Job…
\ Job Position: Process Engineering Assistant Manager Salary Up To RM10000 Location: Batu Kawan, Penang Job Descriptions: Report to Process Engineering Manager.…
Company DescriptionAt Western Digital, our vision is to power global innovation and push the boundaries of technology to make what you thought…
Company DescriptionAt Western Digital, our vision is to power global innovation and push the boundaries of technology to make what you thought…
Company DescriptionAt Western Digital, our vision is to power global innovation and push the boundaries of technology to make what you thought…
\ Malaysia Job details Posted 19 February 2024 SalaryNegotiable LocationMalacca Job type Discipline Reference270432_1708337485 Process Engineering Manager, Molding and Trim & Form…
\ \ Req ID: 123495 Remote Position: No Region: Asia Country: Malaysia State/Province: Johor City: SenaiSummaryThe Manufacturing Process Engineering Manager is responsible…
Company DescriptionAt Western Digital, our vision is to power global innovation and push the boundaries of technology to make what you thought…
\ \ MalaysiaJob details Posted 23 October 2024 SalaryRM5000 RM8000 per annum LocationMalaysia Job type Discipline Reference268089_1729681505Die Bond Process EngineerJob descriptionThis leading…
\ \ Location: Melaka Job ID: HRC0752317Job description In your new role you will: Wire Bond expert, responsible to achieve robust and…
\ \ MalaysiaJob details Posted 18 August 2024 SalaryNegotiable LocationNegeri Sembilan Job type Discipline Reference275078_1723967912Assembly Process Engineering ManagerJob descriptionOur client is a…
\ \ MalaysiaJob details Posted 18 August 2024 SalaryNegotiable LocationMalacca Job type Discipline Reference270201_1723969165Wire Bond Process ManagerJob descriptionThis rapidly expanding Semiconductor company…
\ \ MalaysiaJob details Posted 17 September 2024 SalaryRM10000 RM15000 per month LocationMalaysia Job type Discipline Reference252045_1726550199Wire Bond Principal Process EngineerJob descriptionOur…
\ \ MalaysiaJob details Posted 09 June 2024 SalaryNegotiable LocationMalaysia Job type Discipline Reference273052_1717945453Sr Process Engineering Manager (Wire Bond)Job descriptionOur client is…
\ \ MalaysiaJob details Posted 09 June 2024 SalaryNegotiable LocationMalaysia Job type Discipline Reference273443_1717945401Wire Bond Process Development ManagerJob descriptionOur client is a…
\ \ MalaysiaJob details Posted 11 September 2024 SalaryNegotiable LocationMalaysia Job type Discipline Reference275999_1725988014Process Engineering ManagerJob descriptionOur client is a global leader…