Location:Penang (14100) Salary:CompetitiveType:PermanentMain Industry:Advertiser:Job ID:131577352Posted On:07 February 2025Challenge Yourself and Impact the Future!MacDermid Alpha Electronics Solutions, a business of Element Solutions Inc…
Flex is the diversified manufacturing partner of choice that helps market leading brands design, build and deliver innovative products that improve the…
Colgate Palmolive CompanyLocation:, ,Salary:CompetitiveType:PermanentMain Industry:Other Industries & Skills:Advertising, Marketing & PRAdvertiser:Job ID:131532184Company:Colgate Palmolive CompanyPosted On:23 January 2025No Relocation Assistance Offered # 162962…
Responsible for organization\'s manufacturing assembly processes (wire bond), define product assembly procedures and FMEA. Initiate, direct, and coordinate through the efforts of…
Colgate Palmolive CompanyLocation:, ,Salary:CompetitiveType:PermanentMain Industry:Other Industries & Skills:Advertising, Marketing & PRAdvertiser:Job ID:131451959Company:Colgate Palmolive CompanyPosted On:25 December 2024No Relocation Assistance Offered # 162962…
Our client is a Multinational Semiconductor company in Penang. They are seeking a Sr FOL Process Engineer with exposure to Wire Bond…
\ Job Description In your new role you will: Sustains and continuously improves qualified technologies in volume production with regards to stability,…
\ \ Job Description In your new role you will: Wire Bond expert, responsible to achieve robust and auto pilot processes Sustains…
\ \ MalaysiaJob details Posted 18 August 2024 SalaryNegotiable LocationSelangor Job type Discipline Reference268765_1723969287Wire Bond Development EngineerJob descriptionThis rapidly expanding semiconductor company…
\ \ Location: Melaka Job ID: HRC0752317Job description In your new role you will: Wire Bond expert, responsible to achieve robust and…
\ \ MalaysiaJob details Posted 18 August 2024 SalaryNegotiable LocationMalacca Job type Discipline Reference270201_1723969165Wire Bond Process ManagerJob descriptionThis rapidly expanding Semiconductor company…
\ \ MalaysiaJob details Posted 18 August 2024 SalaryNegotiable LocationMalaysia Job type Discipline Reference252045_1723969380Wire Bond EngineerJob descriptionOur client is a multinational semiconductor…
\ \ MalaysiaJob details Posted 17 September 2024 SalaryRM10000 RM15000 per month LocationMalaysia Job type Discipline Reference252045_1726550199Wire Bond Principal Process EngineerJob descriptionOur…
\ \ MalaysiaJob details Posted 09 June 2024 SalaryNegotiable LocationMalaysia Job type Discipline Reference273052_1717945453Sr Process Engineering Manager (Wire Bond)Job descriptionOur client is…
\ \ MalaysiaJob details Posted 09 June 2024 SalaryNegotiable LocationMalaysia Job type Discipline Reference273443_1717945401Wire Bond Process Development ManagerJob descriptionOur client is a…
MalaysiaJob details Posted 05 December 2024 SalaryRM7000 RM9500 per month LocationMalaysia Job type Discipline Reference278126_1733342773Sr Process Engineer (Wire Bond, Die Bond)Job descriptionOur…
\ \ MalaysiaJob details Posted 17 September 2024 SalaryNegotiable LocationSelangor Job type Discipline Reference268765_1726550364Wire Bond Development EngineerJob descriptionThis rapidly expanding semiconductor company…
\ \ MalaysiaJob details Posted 11 September 2024 SalaryNegotiable LocationMalaysia Job type Discipline Reference275999_1725988014Process Engineering ManagerJob descriptionOur client is a global leader…
\ Your Contribution Develops process and production concepts for improvement of existing processes, implementation of new processes or new products. Prepares requirement…
MalaysiaJob details Posted 22 November 2024 SalaryNegotiable LocationPerak Job type Discipline Reference276685_1732267167Assembly Package Development ManagerJob descriptionThis global semiconductor company in Perak is…