MalaysiaJob details Posted 22 November 2024 SalaryNegotiable LocationSelangor Job type Discipline Reference268765_1732267987Wire Bond Development EngineerJob descriptionThis rapidly expanding semiconductor company in Selangor…
MalaysiaJob details Posted 22 November 2024 SalaryNegotiable LocationMalaysia Job type Discipline Reference276832_1732265868Wire Bond Development EngineerJob descriptionOur client is a semiconductor MNC in…
\ Location: Melaka Job ID: HRC0372399 Job description In your new role you will: Develop and realize process & maintenance concepts. Support…
\ Available Positions: Equipment Engineer/ Senior Engineer Process Engineer/ Senior Engineer Job Responsibilities: 1.Equipment Engineer/ Senior Engineer: Lead in project management and…
\ Location: Melaka Job ID: HRC0324116 Workplace type: On site Job description In your new role you will: Accountable and responsible for…
\ \ MalaysiaJob details Posted 19 July 2024 SalaryRM15000 RM21000 per month LocationMalaysia Job type Discipline Reference273052_1721349840Sr Process Engineering Manager (Wire Bond)Job…
\ Job Description:About Technip EnergiesAt Technip Energies, we believe in a better tomorrow, and we believe we can make tomorrow better. With…
\ Job Description:About Technip EnergiesAt Technip Energies, we believe in a better tomorrow, and we believe we can make tomorrow better. With…
MalaysiaJob details Posted 05 December 2024 SalaryRM7000 RM9500 per month LocationMalaysia Job type Discipline Reference278126_1733342773Sr Process Engineer (Wire Bond, Die Bond)Job descriptionOur…
\ \ Job Description This rapidly expanding semiconductor company in Selangor is seeking a Wire Bond Development Engineer. Key Responsibilities Research and…
\ \ Location: Melaka Job ID: HRC0775119Job description In your new role you will: To sustain, improve the process in order to…
\ \ MalaysiaJob details Posted 23 October 2024 SalaryNegotiable LocationMalaysia Job type Discipline Reference271238_1729681599Wire Bond Process EngineerJob descriptionThis rapidly expanding global semiconductor…
\ Job Description:About Technip EnergiesAt Technip Energies, we believe in a better tomorrow, and we believe we can make tomorrow better. With…
\ \ Job Description In your new role you will: To sustain, improve the process in order to deliver products to customers…
\ Job Description In your new role you will: Develop and realize process & maintenance concepts. Support new product & equipment for…
\ \ MalaysiaJob details Posted 18 August 2024 SalaryNegotiable LocationMalaysia Job type Discipline Reference252045_1723969380Wire Bond EngineerJob descriptionOur client is a multinational semiconductor…
\ StatusPOSITION : Senior Engineer, Instrumentation (Telecommunications) (Offshore)REPORTING TO : Head of Lang Lebah Offshore Engineering Section DIVISION/DEPARTMENT : LLD LLF/E Lang…
\ \ MalaysiaJob details Posted 18 August 2024 SalaryNegotiable LocationSelangor Job type Discipline Reference268765_1723969287Wire Bond Development EngineerJob descriptionThis rapidly expanding semiconductor company…
\ \ MalaysiaJob details Posted 09 June 2024 SalaryNegotiable LocationMalaysia Job type Discipline Reference273052_1717945453Sr Process Engineering Manager (Wire Bond)Job descriptionOur client is…
\ \ MalaysiaJob details Posted 17 September 2024 SalaryRM10000 RM15000 per month LocationMalaysia Job type Discipline Reference252045_1726550199Wire Bond Principal Process EngineerJob descriptionOur…