\ KEY OBJECTIVES Manage and execute Mechanical Construction works for a Central Processing Platform (CPP) starting from EPCIC tendering until completion of…
\ Company Description The future. It\\\'s on you. You & Western Digital. We\\\'ve been storing the world\\\'s data for more than 50…
\ \ Kulim, MY Mar 28, 2024 16345 Be part of our team! AT&S, a world leading high tech PCB & IC…
\ You\\\'re an important part of our future. Hopefully, we\\\'re also a part of yours! At B. Braun, we protect and improve…
\ Company Description The future. It\\\'s on you. You & Western Digital. We\\\'ve been storing the world\\\'s data for more than 50…
\ Kulim, MY Dec 5, 2023 16195 Be part of our team! AT&S, a world leading high tech PCB & IC Substrates…
\ \ MalaysiaJob details Posted 18 August 2024 SalaryNegotiable LocationMalacca Job type Discipline Reference270201_1723969165Wire Bond Process ManagerJob descriptionThis rapidly expanding Semiconductor company…
\ \ MalaysiaJob details Posted 09 June 2024 SalaryNegotiable LocationMalaysia Job type Discipline Reference273052_1717945453Sr Process Engineering Manager (Wire Bond)Job descriptionOur client is…
\ \ MalaysiaJob details Posted 23 October 2024 SalaryNegotiable LocationMalaysia Job type Discipline Reference271238_1729681599Wire Bond Process EngineerJob descriptionThis rapidly expanding global semiconductor…
\ \ MalaysiaJob details Posted 17 September 2024 SalaryNegotiable LocationSelangor Job type Discipline Reference268765_1726550364Wire Bond Development EngineerJob descriptionThis rapidly expanding semiconductor company…
\ Location: Melaka Job ID: HRC0372399 Job description In your new role you will: Develop and realize process & maintenance concepts. Support…
\ Location: Melaka Job ID: HRC0324116 Workplace type: On site Job description In your new role you will: Accountable and responsible for…
\ Available Positions: Equipment Engineer/ Senior Engineer Process Engineer/ Senior Engineer Job Responsibilities: 1.Equipment Engineer/ Senior Engineer: Lead in project management and…
\ \ MalaysiaJob details Posted 19 July 2024 SalaryRM15000 RM21000 per month LocationMalaysia Job type Discipline Reference273052_1721349840Sr Process Engineering Manager (Wire Bond)Job…
\ \ Job Description This rapidly expanding semiconductor company in Selangor is seeking a Wire Bond Development Engineer. Key Responsibilities Research and…
\ Job Description:About Technip EnergiesAt Technip Energies, we believe in a better tomorrow, and we believe we can make tomorrow better. With…
\ Job Description:About Technip EnergiesAt Technip Energies, we believe in a better tomorrow, and we believe we can make tomorrow better. With…
\ \ Location: Melaka Job ID: HRC0775119Job description In your new role you will: To sustain, improve the process in order to…
\ Job Description:About Technip EnergiesAt Technip Energies, we believe in a better tomorrow, and we believe we can make tomorrow better. With…
\ \ Job Description In your new role you will: To sustain, improve the process in order to deliver products to customers…