\ Job Description In your new role you will: Develop and realize process & maintenance concepts. Support new product & equipment for…
\ \ MalaysiaJob details Posted 18 August 2024 SalaryNegotiable LocationMalaysia Job type Discipline Reference252045_1723969380Wire Bond EngineerJob descriptionOur client is a multinational semiconductor…
\ \ MalaysiaJob details Posted 18 August 2024 SalaryNegotiable LocationSelangor Job type Discipline Reference268765_1723969287Wire Bond Development EngineerJob descriptionThis rapidly expanding semiconductor company…
\ \ Job Description In your new role you will: Wire Bond expert, responsible to achieve robust and auto pilot processes Sustains…
\ \ Location: Melaka Job ID: HRC0752317Job description In your new role you will: Wire Bond expert, responsible to achieve robust and…
\ You\\\'re an important part of our future. Hopefully, we\\\'re also a part of yours! At B. Braun, we protect and improve…
\ \ MalaysiaJob details Posted 23 October 2024 SalaryNegotiable LocationMalaysia Job type Discipline Reference271238_1729681599Wire Bond Process EngineerJob descriptionThis rapidly expanding global semiconductor…
\ You\\\'re an important part of our future. Hopefully, we\\\'re also a part of yours! At B. Braun, we protect and improve…
\ Company BackgroundWe are representing world known company with a global footprint that provides high performance, semiconductor based power electronic solutions. As…
\ \ MalaysiaJob details Posted 17 September 2024 SalaryNegotiable LocationSelangor Job type Discipline Reference268765_1726550364Wire Bond Development EngineerJob descriptionThis rapidly expanding semiconductor company…
\ Company DescriptionAt Western Digital, our vision is to power global innovation and push the boundaries of technology to make what you…
\ Company DescriptionAt Western Digital, our vision is to power global innovation and push the boundaries of technology to make what you…
\ \ MalaysiaJob details Posted 17 September 2024 SalaryRM10000 RM15000 per month LocationMalaysia Job type Discipline Reference252045_1726550199Wire Bond Principal Process EngineerJob descriptionOur…
\ Job Description In your new role you will: To drive wire bond planned maintenance systematic & methodology to ensure machine performance…
\ Location: Melaka Job ID: HRC0472631 Job description In your new role you will: To drive wire bond planned maintenance systematic &…
\ Location: Melaka Job ID: HRC0372399 Job description In your new role you will: Develop and realize process & maintenance concepts. Support…
\ \ Location: Melaka Job ID: HRC0200996 Job description In your new role you will: Monitor & sustain machine OEE performance, quality…
\ \ Job Description In your new role you will: Monitor & sustain machine OEE performance, quality and yield of assembly processes…
\ \ Location: Melaka Job ID: HRC0800334Job description In your new role you will: Trouble shoot and diagnose difficult, infrequent problems in…
\ Company Description At Western Digital, our vision is to power global innovation and push the boundaries of technology to make what…