\ Malaysia Job details Posted 19 February 2024 SalaryNegotiable LocationJohor Job type Discipline Reference269581_1708338581 Staff Process Engineer, Die Bond Job description This…
\ Job Description In your new role you will: Sustains and continuously improves qualified technologies in volume production with regards to stability,…
\ \ Location: Melaka Job ID: HRC0752317Job description In your new role you will: Wire Bond expert, responsible to achieve robust and…
\ \ MalaysiaJob details Posted 18 August 2024 SalaryNegotiable LocationSelangor Job type Discipline Reference268765_1723969287Wire Bond Development EngineerJob descriptionThis rapidly expanding semiconductor company…
\ \ Job Description In your new role you will: Wire Bond expert, responsible to achieve robust and auto pilot processes Sustains…
\ \ MalaysiaJob details Posted 18 August 2024 SalaryNegotiable LocationMalacca Job type Discipline Reference270201_1723969165Wire Bond Process ManagerJob descriptionThis rapidly expanding Semiconductor company…
\ \ MalaysiaJob details Posted 18 August 2024 SalaryNegotiable LocationMalaysia Job type Discipline Reference252045_1723969380Wire Bond EngineerJob descriptionOur client is a multinational semiconductor…
\ \ MalaysiaJob details Posted 09 June 2024 SalaryNegotiable LocationMalaysia Job type Discipline Reference273443_1717945401Wire Bond Process Development ManagerJob descriptionOur client is a…
\ Company DescriptionAt Western Digital, our vision is to power global innovation and push the boundaries of technology to make what you…
\ Malaysia Job details Posted 04 November 2023 SalaryRM5000 RM8000 per annum LocationMalaysia Job type Discipline Reference268089_1699091116 Die Bond Process Engineer Job…
\ \ MalaysiaJob details Posted 19 May 2024 SalaryNegotiable LocationMalaysia Job type Discipline Reference273443_1716051585Wire Bond Process Development ManagerJob descriptionOur client is a…
\ \ MalaysiaJob details Posted 19 July 2024 SalaryNegotiable LocationMalaysia Job type Discipline Reference273443_1721349295Wire Bond Process Development ManagerJob descriptionOur client is a…
\ Malaysia Job details Posted 10 September 2023 SalaryRM5000 RM8000 per annum LocationMalaysia Job type Discipline Reference268089_1694277399 Process Engineer, Die Bond Job…
\ \ Location: Melaka Job ID: HRC0169097 Job description In your new role you will: Sustains and continuously improves qualified technologies in…
\ \ Job details\ \ \ \ Posted 04 November 2023\ \ \ SalaryRM5000 RM8000 per annum\ \ \ LocationMalaysia\ \ \…
\ \ Job details\ \ \ \ Posted 04 November 2023\ \ \ SalaryNegotiable\ \ \ LocationMalaysia\ \ \ Job type Permanent…
\ \ Job Description This rapidly expanding semiconductor company in Selangor is seeking a Wire Bond Development Engineer. Key Responsibilities Research and…
\ Location: Melaka Job ID: HRC0338347 Job description In your new role you will: Sustains and continuously improves qualified technologies in volume…
\ \ Job Description In your new role you will: To sustain, improve the process in order to deliver products to customers…
\ \ Location: Melaka Job ID: HRC0775119Job description In your new role you will: To sustain, improve the process in order to…